Solder alloys and arrangements

US9735126B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Manfred Mengel · Bad Abbach, DE
• Alexander Heinrich · Bad Abbach, DE
• Steffen ORSO · Reutlingen, DE
• Thomas Behrens · Madison, US
• Oliver Eichinger · Regensburg, DE
• Lim Fong · Melaka City, MY
• Evelyn Napetschnig · Diex, AT
• Edmund Riedl · Bergneustadt, DE

Key dates

• Filing date: Jun 7, 2011
• Grant date: Aug 15, 2017
• Expiry date: Jun 7, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/207
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.