Patent · US Active

Electronic device and method of fabricating an electronic device

US9756726B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexander Heinrich · Bad Abbach, DE
Peter Scherl · Regensburg, DE
Magdalena Hoier · Regensburg, DE
Hans-Joerg Timme · Ottobrunn, DE

Key dates

Filing date	Nov 4, 2013
Grant date	Sep 5, 2017
Priority date	—
Expiry date	Mar 5, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49126
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.