Repeater detection

US9766187B2 · kind B2 · utility

Assignee

• KLA-TENCOR CORPORATION · US

Inventors

• Hong Chen · Zhejiang, CN
• Kenong Wu · Davis, US
• Eugene Shifrin · Sunnyvale, US
• Masatoshi Yamaoka · Osaka, JP
• Gangadharan Sivaraman · Chennai, IN
• Raghav Babulnath · San Jose, US
• Satya Kurada · Fremont, US
• Shuo Sun · Fremont, US

Key dates

• Filing date: Aug 27, 2015
• Grant date: Sep 19, 2017
• Expiry date: Sep 28, 2035

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N21/95
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).