Method for structuring a substrate
US9768023B1 · kind B1 · utility
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4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2015 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Nov 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/70
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various embodiments, a method of processing a substrate may include: disposing a viscous material over a substrate including at least one topography feature extending into the substrate to form a protection layer over the substrate; adjusting a viscosity of the viscous material during a contacting period of the viscous material and the substrate to stabilize a spatial distribution of the viscous material as disposed; processing the substrate using the protection layer as mask; and removing the protection layer after processing the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.