Inventor · Klagenfurt, AT

Markus Heinrici

12Patents

3h-index

29Co-inventors

52Inventor score

Filing activity: Jan 24, 2014 → May 30, 2019

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9673096B2	Method for processing a semiconductor substrate and a method for processing a semiconductor wafer	Electricity	21	Active
US9844134B2	Device including a metallization layer and method of manufacturing a device	Electricity	9	Active
US9620466B1	Method of manufacturing an electronic device having a contact pad with partially sealed pores	Electricity	3	Active
US9190322B2	Method for producing a copper layer on a semiconductor body using a printing process	Electricity	2	Active
US9929111B2	Method of manufacturing a layer structure having partially sealed pores	Electricity	2	Active
US11195713B2	Methods of forming a silicon-insulator layer and semiconductor device having the same	Electricity	0	Active
US9768023B1	Method for structuring a substrate	Electricity	0	Active
US10373868B2	Method of processing a porous conductive structure in connection to an electronic component on a substrate	Electricity	0	Active
US10967450B2	Slicing SiC material by wire electrical discharge machining	Electricity	0	Active
US10453806B2	Methods for forming semiconductor devices and semiconductor device	Electricity	0	Active
US9818602B2	Method of depositing a resin material on a semiconductor body with an inkjet process	Chemistry; Metallurgy	0	Active
US9793119B2	Method for structuring a substrate using a protection layer as a mask	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.