Semiconductor package in package
US9768124B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2016 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Sep 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package having a second semiconductor package or module integrated therein. The semiconductor package of the present invention typically comprises active and passive devices which are each electrically connected to an underlying substrate. The substrate is configured to place such active and passive devices into electrical communication with contacts of the substrate disposed on a surface thereof opposite that to which the active and passive devices are mounted. The module of the semiconductor package resides within a complimentary opening disposed within the substrate thereof. The module and the active and passive devices of the semiconductor package are each fully or at least partially covered by a package body of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.