Method of forming ANA regions in an integrated circuit
US9786545B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Sep 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/601
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes providing a structure having a first hardmask layer, interposer layer, second hardmask layer and mandrel layer disposed respectively over a dielectric stack. An array of mandrels is patterned into the mandrel layer with a mandrel mask. An ANA trench is patterned into the mandrel layer with a first cut mask. The ANA trench is patterned into the interposer layer with a second cut mask. An organic planarization layer (OPL) is disposed over the structure. The OPL is etched to dispose it only in the ANA trench such that a top surface of the OPL is lower than the second hardmask layer. The structure is etched to form a pattern in a dielectric layer of the dielectric stack to form an array of metal lines in the dielectric layer, a portion of the pattern formed by the ANA trench forms an ANA region within the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.