Defect detection process in a semiconductor manufacturing environment
US9791849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Apr 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A process for detecting foreign particle defects and scratch defects on semiconductor products including detecting foreign particle and scratch defects on the semiconductor products; placing the semiconductor products in a first wafer carrier and docking to a first load port of a semiconductor processing tool; opening a door of the first wafer carrier; transferring the semiconductor products from the first wafer carrier through the first load port to and through an interior of the semiconductor processing tool to a second load port of the semiconductor processing tool; transferring the semiconductor products from the second load port to a second wafer carrier; closing a door of the second wafer carrier and undocking from the second load port; and detecting foreign particle and scratch defects on the semiconductor products and comparing to the foreign particle defects on the semiconductor products prior to placing the semiconductor products in the first wafer carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.