Multi-layered chemical-mechanical planarization pad
US9796063B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2014 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Mar 6, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.