Barrier structures for underfill blockout regions
US9798088B2 · kind B2 · utility
5Cited by
34References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2015 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Nov 8, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/428
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The disclosure relates to semiconductor structures and, more particularly, to barrier structures for underfill blockout regions uses in phonotics chip packaging and methods of manufacture. The structure includes a substrate with a plurality of solder connections and at least one optical fiber interface disposed within at least one cavity of the substrate. The structure further includes a barrier structure formed about the cavity which is structured to prevent underfill material from degrading an optical coupling of the optical fiber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.