Electrostatic chuck with thermal choke
US9805963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2015 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Jan 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses, systems, and techniques for providing enhanced electrostatic chucks are provided. Such apparatuses, systems, and techniques may include, for example, a common RF and DC electrode in an electrostatic chuck, connection, at a location external to a semiconductor processing chamber, of a high-voltage DC power source and a high-voltage RF power source to a common conductive pathway leading to an electrostatic chuck in the interior of the semiconductor processing chamber, a very thin dielectric layer located on an upper surface of an electrostatic chuck, and/or an axial thermal choke that may be used to control heat flow within an electrostatic chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.