Patent · US Active

Method of depositing a resin material on a semiconductor body with an inkjet process

US9818602B2 · kind B2 · utility

0Cited by

9References

15Claims

0Family size

Assignees

Infineon Technologies AG · DE
Technische Universität Wien · AT

Inventors

Stefan Schwab · Wien, AT
Markus Heinrici · Klagenfurt, AT
Rafael Janski · Villach, AT
Susanne Kraeuter · London, GB
Martin Mischitz · Wernberg, AT

Key dates

Filing date	Sep 22, 2015
Grant date	Nov 14, 2017
Priority date	—
Expiry date	Sep 22, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2463/00
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method a described which includes depositing a first component of a multicomponent system by means of an inkjet process, and depositing a second component of the multicomponent system by means of an inkjet process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.