Stacked-die MEMS resonator system
US9821998B2 · kind B2 · utility
8Cited by
52References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2016 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Jun 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In a microelectromechanical system (MEMS) device, a CMOS die is affixed to a die-mounting surface and wire-bonded to electrically conductive leads, and a MEMS die is stacked on and electrically coupled to the CMOS die in a flip-chip configuration. A package enclosure envelopes the MEMS die, CMOS die and wire bonds, and exposes respective regions of the electrically conductive leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.