Patent · US Active

Chemical-mechanical polishing compositions comprising N,N,N′,N′-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid

US9828527B2 · kind B2 · utility

1Cited by
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6Claims
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Key dates

Filing dateOct 27, 2016
Grant dateNov 28, 2017
Priority date—
Expiry dateOct 27, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/30625
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Described is a chemical-mechanical polishing (CMP) composition comprising the following components:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.