Controlling for wafer stage vibration
US9835959B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 17, 2016 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Oct 17, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/709
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method includes producing a pulsed light beam; directing the pulsed light beam toward a substrate mounted to a stage of a lithography exposure apparatus; scanning a pulsed light beam and the substrate relative to each other, including projecting the pulsed light beam onto each sub-area of the substrate and moving one or more of the pulsed light beam and the substrate relative to each other; determining a value of a vibration of the stage for each sub-area of a substrate; for each sub-area of the substrate, determining an amount of adjustment to a bandwidth of the pulsed light beam, the adjustment amount compensating for a variation in the stage vibration so as to maintain a focus blur within a predetermined range of values across the substrate; and changing the bandwidth of the pulsed light beam by the determined adjustment amount to thereby compensate for the stage vibration variations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.