Method for maximizing air gap in back end of the line interconnect through via landing modification
US9837355B2 · kind B2 · utility
294Cited by
12References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 22, 2016 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Mar 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53266
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming an interconnect to an electrical device is provided. The structure produced by the method may include a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parrallel lengths; and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.