Patent · US Active

Methods of vapor deposition with multiple vapor sources

US9873942B2 · kind B2 · utility

3Cited by
41References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 11, 2015
Grant dateJan 23, 2018
Priority date
Expiry dateJul 20, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/28194
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Methods of vapor deposition include multiple vapor sources. A vapor deposition method includes delivering pulses of a vapor containing a first source chemical to a reaction space from at least two separate source vessels simultaneously. The pulses can contain a substantially consistent concentration of the first source chemical. The method can include purging the reaction space of an excess of the first source chemical after the delivering, and delivering pulses of a vapor containing a second source chemical to the reaction space from at least two separate source vessels simultaneously after the purging.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.