Substrate support assembly having rapid temperature control
US9883549B2 · kind B2 · utility
6Cited by
95References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2016 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Jan 16, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support assembly comprises a ceramic puck having a substrate receiving surface and an opposing backside surface. The ceramic puck has an electrode and a heater embedded therein. The heater comprises first and second coils that are radially spaced apart. A base of the support assembly comprises a channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself. A compliant layer bonds the ceramic puck to the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.