Cap layer for spacer-constrained epitaxially grown material on fins of a FinFET device
US9899268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2015 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Apr 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/017
Abstract
A method includes forming at least one fin in a semiconductor substrate. A fin spacer is formed on at least a first portion of the at least one fin. The fin spacer has an upper surface. The at least one fin is recessed to thereby define a recessed fin with a recessed upper surface that it is at a level below the upper surface of the fin spacer. A first epitaxial material is formed on the recessed fin. A lateral extension of the first epitaxial material is constrained by the fin spacer. A cap layer is formed on the first epitaxial material. The fin spacer is removed. The cap layer protects the first epitaxial material during the removal of the fin spacer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.