Flip chip module with enhanced properties

US9899350B2 · kind B2 · utility

Assignee

• Qorvo US, Inc. · US

Inventors

• Julio C. Costa · Oak Ridge, US
• Thomas Scott Morris · Lewisville, US
• Jonathan Hale Hammond · Oak Ridge, US
• David Jandzinski · Greenville, US
• Stephen Parker · Burlington, US
• Jon Chadwick · Greensboro, US

Key dates

• Filing date: Aug 5, 2016
• Grant date: Feb 20, 2018
• Expiry date: Aug 5, 2036

Classification

• Technology area (CPC —): General

Abstract

A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.