Holes and dimples to control solder flow
US9911684B1 · kind B1 · utility
0Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2016 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Aug 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1304
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system, in some embodiments, comprises: a first surface of a lead frame; a second surface of the lead frame, opposite the first surface, said second surface having been etched; and one or more holes passing through said lead frame and coincident with the first and second surfaces, wherein said one or more holes are adapted to control fluid flow on said first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.