Integrated fan-out pillar probe system

US9915699B2 · kind B2 · utility

Assignee

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

• Mill-Jer Wang · Hsinchu, TW
• Ching-Nen Peng · Hsinchu, TW
• Hung-Chih Lin · Baoshan, TW
• Hao Chen
• Mincent Lee · Taipei, TW
• Chen-Hung Tien · Baoshan, TW
• Chang Chia How · Baoshan, TW

Key dates

• Filing date: Sep 17, 2014
• Grant date: Mar 13, 2018
• Expiry date: Feb 13, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2894
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method of probe testing dies, the method includes loading a wafer having a first die and a second die into a prober and bringing probes of the prober into contact with first contact pads of the first die according to first probe parameters. A first probe contact test of first values of the contact between the probes and the first contact pads is performed, and a die test of the first die is performed after performing the probe contact test. Results of the die test and results of the probe contact test are saved and second probe parameters are automatically generated based on at least the results of the first probe contact test.