Wafer rotation in a semiconductor chamber
US9922819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2017 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Feb 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for processing a substrate are provided. The apparatus includes a pedestal and rotation member, both of which are moveably disposed within a processing chamber. The rotation member is adapted to rotate a substrate disposed in the chamber. The substrate may be supported by an edge ring during processing. The edge ring may selectively engage either the pedestal or the rotation member. In one embodiment, the edge ring engages the pedestal during a deposition process and the edge ring engages the rotation member during rotation of the substrate. The rotation of the substrate during processing may be discrete or continuous.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.