Process for producing a structure by assembling at least two elements by direct adhesive bonding
US9922953B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2015 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Feb 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/04953
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a structure by direct bonding of two elements, the method including: production of the elements to be assembled and assembly of the elements. The production of the elements to be assembled includes: deposition on a substrate of a TiN layer by physical vapor deposition, and deposition of a copper layer on the TiN layer. The assembly of the elements includes: polishing the surfaces of the copper layers intended to come into contact so that they have a roughness of less than 1 nm RMS and hydrophilic properties, bringing the surfaces into contact, and storing the structure at atmospheric pressure and at ambient temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.