Bruno Imbert
15Patents
0h-index
18Co-inventors
37Inventor score
Filing activity: Jul 5, 2011 → Jul 14, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10403597B2 | Direct bonding method | Electricity | 0 | Active |
| US9472530B2 | Method for carrying out a conductive direct metal bonding | Electricity | 0 | Active |
| US10283364B2 | Method for assembling substrates by bonding indium phosphate surfaces | Chemistry; Metallurgy | 0 | Active |
| US10710192B2 | Method for adhering a first structure and a second structure | Electricity | 0 | Active |
| US10586783B2 | Method for direct bonding of III-V semiconductor substrates with a radical oxide layer | Electricity | 0 | Active |
| US9922953B2 | Process for producing a structure by assembling at least two elements by direct adhesive bonding | Electricity | 0 | Active |
| US9991439B2 | Method for implanting a piezoelectric material | Emerging Cross-Sectional Technologies | 0 | Active |
| US10236210B2 | Direct bonding method | Electricity | 0 | Active |
| US10679963B2 | Method for assembling two substrates of different natures via a ductile intermediate layer | Electricity | 0 | Active |
| US8715517B2 | Process for fabricating an acoustic wave resonator comprising a suspended membrane | Electricity | 0 | Active |
| US10032742B2 | Method for obtaining a bonding surface for direct bonding | Emerging Cross-Sectional Technologies | 0 | Active |
| US10759921B2 | Method for producing an aqueous foam | Chemistry; Metallurgy | 0 | Active |
| US9735038B2 | Process for manufacturing a semiconductor structure with temporary bonding via metal layers | Electricity | 0 | Active |
| US10483111B2 | Metal-metal direct bonding method | Electricity | 0 | Active |
| US10115698B2 | Method for direct adhesion via low-roughness metal layers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.