Sensor unit including a decoupling structure and manufacturing method therefor

US9926188B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Johannes Classen · Reutlingen, DE
• Torsten Kramer · Wannweil, DE
• Hubert Benzel · Neckartenzlingen, DE
• Jens Frey · Echterdingen, DE
• Daniel Christoph Meisel · Pittsburgh, US
• Christoph Schelling · Stuttgart, DE

Key dates

• Filing date: Feb 5, 2015
• Grant date: Mar 27, 2018
• Expiry date: Feb 5, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.