Wafer probe alignment

US9927463B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Joerg G. Appinger · Aidlingen, DE
• Eberhard Dengler · Eppelheim, DE
• Roland Dieterle · St. Georgen, DE
• Martin Eckert · Metzingen, DE
• Gabriele Kuczera · Eppelheim, DE
• Siegfried Tomaschko · Neustadt, DE
• Otto A. Torreiter · Echterdingen, DE
• Quintino L. Trianni · Balingen, DE

Key dates

• Filing date: Oct 20, 2015
• Grant date: Mar 27, 2018
• Expiry date: Feb 18, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2891
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A water probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.