Polishing pad with foundation layer and polishing surface layer
US9931728B2 · kind B2 · utility
0Cited by
30References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2015 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Jul 26, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.