Metal protected fan-out cavity

US9953959B1 · kind B1 · utility

Assignee

• Intel Corporation · US

Inventors

• Kristof Darmawikarta · Chandler, US
• Robert Alan May · Chandler, US
• Yikang Deng · New York, US
• Amruthavalli Pallavi Alur · Tempe, US
• Sheng Li · Santa Clara, US
• Chong Zhang · Chandler, US
• Sri Chaitra Jyotsna Chavali · Chandler, US
• Amanda E. Schuckman · Scottsdale, US

Key dates

• Filing date: Mar 20, 2017
• Grant date: Apr 24, 2018
• Expiry date: Mar 20, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2225/1088
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A metal protected fan-out cavity enables assembly of a package-on-package (PoP) integrated circuit while reducing PoP solder spacing and overall z-height. A horizontal fan-out conductor provides a contact between a die contact and a lower package via. A metal protection layer may be used during manufacture to protect the fan-out conductor, such as providing a laser stop during laser skiving. The metal protection layer materials and an etching solution may be selected to allow for subsequent removal via etching while leaving the fan-out conductor intact. The metal protection layer and fan-out conductor materials may also be selected to reduce or eliminate formation of an intermetallic compound (IMC) between the metal protection layer and the fan-out conductor.