Apparatus for semiconductor wafer treatment and semiconductor wafer treatment
US9966266B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Apr 25, 2016 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Apr 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/0223
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for semiconductor wafer treatment includes a wafer holding unit configured to receive a single wafer, at least a solution supply unit configured to apply a solution onto the wafer and an irradiation unit configured to emit irradiation to the wafer. The irradiation unit further includes at least a plurality of first light sources configured to emit irradiation in FIR range and a plurality of second light sources configured to emit irradiation in UV range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.