Wafer-handling end effectors with wafer-contacting surfaces and sealing structures
US9991152B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2015 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Apr 24, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S901/40
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.