Microelectronic package having a passive microelectronic device disposed within a package body

US9997444B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Thorsten Meyer · Regensburg, DE
• Gerald Ofner · Regensburg, DE
• Andreas Wolter · Regensburg, DE
• Georg Seidemann · Landshut, DE
• Sven Albers · Regensburg, DE
• Christian Geissler · Teugn, DE

Key dates

• Filing date: Mar 12, 2014
• Grant date: Jun 12, 2018
• Expiry date: Mar 12, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microelectronic package including a passive microelectronic device disposed within a package body, wherein the package body is the portion of the microelectronic package which provides support and/or rigidity to the microelectronic package. In a flip-chip type microelectronic package, the package body may comprise a microelectronic substrate to which an active microelectronic device is electrically attached. In an embedded device type microelectronic package, the package body may comprise the material in which the active microelectronic device is embedded.