Inspection method and apparatus and lithographic processing cell
USRE49460E1 · kind E1 · reissue
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Key dates
| Filing date | Mar 3, 2015 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Mar 3, 2035 |
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- Technology area (CPC —)General
Abstract
A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.