ChipScale, Inc.
14Patents
0Active
14Granted
31Portfolio score
Filing activity: May 11, 1994 → Feb 20, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5910687A | Wafer fabrication of die-bottom contacts for electronic devices | Electricity | 113 | Expired |
| US6221751A | Wafer fabrication of die-bottom contacts for electronic devices | Electricity | 106 | Expired |
| US6051489A | Electronic component package with posts on the active side of the substrate | Electricity | 51 | Expired |
| US5557149A | Semiconductor fabrication with contact processing for wrap-around flange interface | Electricity | 27 | Expired |
| US5656547A | Method for making a leadless surface mounted device with wrap-around flange interface contacts | Electricity | 27 | Expired |
| US6121119A | Resistor fabrication | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5904496A | Wafer fabrication of inside-wrapped contacts for electronic devices | Electricity | 17 | Expired |
| US5592022A | Fabricating a semiconductor with an insulative coating | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6355981B1 | Wafer fabrication of inside-wrapped contacts for electronic devices | Electricity | 9 | Expired |
| US6414585B1 | Integrated passive components and package with posts | Electricity | 8 | Expired |
| US6833986B2 | Integrated passive components and package with posts | Electricity | 5 | Expired |
| US5789817A | Electrical apparatus with a metallic layer coupled to a lower region of a substrate and a metallic layer coupled to a lower region of a semiconductor device | Electricity | 4 | Expired |
| US6946734B2 | Integrated passive components and package with posts | Electricity | 2 | Expired |
| US6954130B2 | Integrated passive components and package with posts | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.