Alan Wang
4Patents
2h-index
3Co-inventors
37Inventor score
Filing activity: Oct 13, 1999 → Oct 18, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6416836B1 | Thermally annealed, low defect density single crystal silicon | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6743289B2 | Thermal annealing process for producing low defect density single crystal silicon | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8598467B2 | Multi-layer circuit assembly and process for preparing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US8065795B2 | Multi-layer circuit assembly and process for preparing the same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.