Laminate and method of manufacture thereof
US6207595A · kind A · utility
30Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1998 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Mar 2, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2992
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fabric material and method of its manufacture suitable for use in electronic packages including chip carriers. High insulation resistance is exhibited when subjected to high temperatures and humidity stress conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.