Avishay Katz
11Patents
8h-index
19Co-inventors
61Inventor score
Filing activity: Aug 16, 1989 → May 10, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5234149A | Debondable metallic bonding method | Emerging Cross-Sectional Technologies | 89 | Expired |
| US5234153A | Permanent metallic bonding method | Electricity | 40 | Expired |
| US5197654A | Bonding method using solder composed of multiple alternating gold and tin layers | Emerging Cross-Sectional Technologies | 35 | Expired |
| US5232873A | Method of fabricating contacts for semiconductor devices | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5089438A | Method of making an article comprising a TiN.sub.x layer | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5334306A | Metallized paths on diamond surfaces | Electricity | 26 | Expired |
| US5036023A | Rapid thermal processing method of making a semiconductor device | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5622305A | Bonding scheme using group VB metallic layer | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5486263A | Etching a diamond body with a molten or partially molten metal | Emerging Cross-Sectional Technologies | 5 | Expired |
| US5230145A | Assembly including patterned diamond film submount with self-aligned laser device | Emerging Cross-Sectional Technologies | 2 | Expired |
| US5100836A | Method of making a semiconductor device | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.