Bo Chen
6Patents
1h-index
17Co-inventors
37Inventor score
Filing activity: Jun 29, 2016 → Feb 25, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10332862B2 | Semiconductor package structure and method for manufacturing the same | Electricity | 5 | Active |
| US10991660B2 | Semiconductor package having high mechanical strength | Electricity | 1 | Active |
| US11309233B2 | Power semiconductor package having integrated inductor, resistor and capacitor | Electricity | 0 | Active |
| US11062969B2 | Wafer level chip scale package structure and manufacturing method thereof | Electricity | 0 | Active |
| US10242926B2 | Wafer level chip scale package structure and manufacturing method thereof | Electricity | 0 | Active |
| US10840219B2 | Semiconductor package structure and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.