Inventor · Bet Shemesh, IL

Charles Rosenstein

10Patents

4h-index

15Co-inventors

49Inventor score

Filing activity: Oct 31, 2006 → Jun 29, 2015

Most-cited inventions

Patent	Title	Area	Cited by	Status
US7935568B2	Wafer-level fabrication of lidded chips with electrodeposited dielectric coating	Electricity	59	Active
US7807508B2	Wafer-level fabrication of lidded chips with electrodeposited dielectric coating	Electricity	55	Active
US7936062B2	Wafer level chip packaging	Electricity	54	Active
US7791199B2	Packaged semiconductor chips	Electricity	43	Active
US8653644B2	Packaged semiconductor chips with array	Electricity	3	Active
US9548254B2	Packaged semiconductor chips with array	Electricity	1	Active
US8053281B2	Method of forming a wafer level package	Electricity	1	Active
US8704347B2	Packaged semiconductor chips	Electricity	0	Active
US8569876B2	Packaged semiconductor chips with array	Electricity	0	Active
US9070678B2	Packaged semiconductor chips with array	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.