Chi-Ming Liao
4Patents
0h-index
7Co-inventors
24Inventor score
Filing activity: Oct 15, 2013 → May 22, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9660023B2 | Semiconductor film with adhesion layer and method for forming the same | Electricity | 0 | Active |
| US9543141B2 | Method for curing flowable layer | Electricity | 0 | Active |
| US10269900B2 | Semiconductor film with adhesion layer and method for forming the same | Electricity | 0 | Active |
| US9219120B2 | Semiconductor film with adhesion layer and method for forming the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.