Christin Bartsch
7Patents
3h-index
10Co-inventors
46Inventor score
Filing activity: Apr 22, 2005 → Jun 10, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7259091B2 | Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer | Electricity | 258 | Expired |
| US7410885B2 | Method of reducing contamination by removing an interlayer dielectric from the substrate edge | Electricity | 7 | Active |
| US7986040B2 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Electricity | 6 | Active |
| US8664115B2 | Copper interconnect with metal hardmask removal | Electricity | 2 | Active |
| US8338293B2 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Electricity | 0 | Active |
| US8423320B2 | Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related models | Physics | 0 | Active |
| US8673087B2 | Reducing copper defects during a wet chemical cleaning of exposed copper surfaces in a metallization layer of a semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.