Christoffer Erbert
4Patents
0h-index
18Co-inventors
31Inventor score
Filing activity: Nov 14, 2017 → Aug 18, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12183696B2 | Semiconductor device including bonding pad metal layer structure | Electricity | 0 | Active |
| US11195713B2 | Methods of forming a silicon-insulator layer and semiconductor device having the same | Electricity | 0 | Active |
| US10453806B2 | Methods for forming semiconductor devices and semiconductor device | Electricity | 0 | Active |
| US11764176B2 | Semiconductor device including bonding pad metal layer structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.