Daisuke Komada
10Patents
6h-index
10Co-inventors
63Inventor score
Filing activity: Nov 30, 1994 → Aug 30, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6498089B2 | Semiconductor integrated circuit device with moisture-proof ring and its manufacture method | Electricity | 76 | Expired |
| US6627554B1 | Semiconductor device manufacturing method | Electricity | 15 | Expired |
| US6787907B2 | Semiconductor device with dual damascene wiring | Electricity | 14 | Expired |
| US5560803A | Plasma ashing method with oxygen pretreatment | Physics | 12 | Expired |
| US7119009B2 | Semiconductor device with dual damascene wiring | Electricity | 10 | Expired |
| US6769819B2 | Optical device module | Physics | 7 | Expired |
| US6599841B2 | Method for manufacturing a semiconductor device | Electricity | 4 | Expired |
| US6787474B2 | Manufacture method for semiconductor device having silicon-containing insulating film | Electricity | 2 | Expired |
| US11944456B2 | Ceramic guide, ceramic guide device, and cermic guide module | Human Necessities | 0 | Active |
| US11675141B2 | Optical connector ferrule, optical connector, and composite fiber connecting assembly | Human Necessities | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.