Daniel Arnzen
6Patents
6h-index
14Co-inventors
56Inventor score
Filing activity: Nov 5, 1996 → Jun 27, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6016012A | Thin liner layer providing reduced via resistance | Electricity | 36 | Expired |
| US7507944B1 | Non-planar packaging of image sensor | Electricity | 28 | Active |
| US6833622B1 | Semiconductor topography having an inactive region formed from a dummy structure pattern | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6165375A | Plasma etching method | Electricity | 9 | Expired |
| US7129178B1 | Reducing defect formation within an etched semiconductor topography | Electricity | 8 | Expired |
| US6406640B1 | Plasma etching method | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.