David Schroeder
11Patents
5h-index
22Co-inventors
58Inventor score
Filing activity: Jan 11, 2002 → Aug 11, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6936543B2 | CMP method utilizing amphiphilic nonionic surfactants | Electricity | 38 | Expired |
| US6821897B2 | Method for copper CMP using polymeric complexing agents | Electricity | 27 | Expired |
| US7091604B2 | Three dimensional integrated circuits | Electricity | 21 | Expired |
| US6726534B1 | Preequilibrium polishing method and system | Electricity | 17 | Expired |
| US7485241B2 | Chemical-mechanical polishing composition and method for using the same | Electricity | 12 | Expired |
| US6612911B2 | Alkali metal-containing polishing system and method | Chemistry; Metallurgy | 5 | Expired |
| US7238618B2 | System for the preferential removal of silicon oxide | Electricity | 4 | Expired |
| US7754098B2 | Chemical-mechanical polishing composition and method for using the same | Electricity | 2 | Active |
| US8529680B2 | Compositions for CMP of semiconductor materials | Electricity | 2 | Active |
| US7803203B2 | Compositions and methods for CMP of semiconductor materials | Electricity | 1 | Active |
| US7365013B2 | System for the preferential removal of silicon oxide | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.