Dewali Ray
8Patents
3h-index
9Co-inventors
46Inventor score
Filing activity: Jul 20, 2007 → May 28, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8503156B2 | Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Electricity | 15 | Active |
| US8084854B2 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods | Electricity | 12 | Active |
| US9209158B2 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods | Electricity | 3 | Active |
| US7989022B2 | Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Electricity | 1 | Active |
| US11011521B2 | Semiconductor structure patterning | Electricity | 1 | Active |
| US8929052B2 | Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Electricity | 0 | Active |
| US10964475B2 | Formation of a capacitor using a sacrificial layer | Electricity | 0 | Active |
| US10020287B2 | Pass-through interconnect structure for microelectronic dies and associated systems and methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.