Eric Cornelis Egbertus Van Grunsven
10Patents
4h-index
23Co-inventors
56Inventor score
Filing activity: Nov 3, 2006 → Mar 29, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7704881B2 | Producing a covered through substrate via using a temporary cap layer | Electricity | 8 | Active |
| US8395267B2 | Through-substrate via and redistribution layer with metal paste | Electricity | 7 | Active |
| US8138087B2 | Method of manufacturing an integrated circuit | Electricity | 6 | Active |
| US8416047B2 | Inductive components for DC/DC converters and methods of manufacture thereof | Emerging Cross-Sectional Technologies | 5 | Active |
| US10107489B2 | Particulate water-activatable luminescent materials | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US9583676B2 | Low warpage wafer bonding through use of slotted substrates | Electricity | 1 | Active |
| US9961778B2 | Liquid immersion transfer of electronics | Emerging Cross-Sectional Technologies | 0 | Active |
| US10084110B2 | Low warpage wafer bonding through use of slotted substrates | Electricity | 0 | Active |
| US8482136B2 | Fan-out chip scale package | Electricity | 0 | Active |
| US12092271B2 | Optical and thermal improvement of a two-sided multi-channel filament | Mechanical Engineering; Lighting; Heating | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.