Achieving mechanical and thermal stability in a multi-chip package
US8421217B2 · kind B2 · utility
15Cited by
27References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2012 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Mar 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.