Achieving mechanical and thermal stability in a multi-chip package
US8202765B2 · kind B2 · utility
17Cited by
20References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Jun 19, 2012 |
| Priority date | — |
| Expiry date | Jul 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.