Evan E. Davidson
9Patents
9h-index
14Co-inventors
66Inventor score
Filing activity: Sep 8, 1975 → Jul 8, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5177594A | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance | Electricity | 103 | Expired |
| US5639163A | On-chip temperature sensing system | Physics | 49 | Expired |
| US5495397A | Three dimensional package and architecture for high performance computer | Emerging Cross-Sectional Technologies | 34 | Expired |
| US5817986A | Three dimensional package and architecture for high performance computer | Emerging Cross-Sectional Technologies | 28 | Expired |
| US4015147A | Low power transmission line terminator | Electricity | 19 | Expired |
| US4398106A | On-chip Delta-I noise clamping circuit | Physics | 16 | Expired |
| US6268238A | Three dimensional package and architecture for high performance computer | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5935687A | Three dimensional package and architecture for high performance computer | Emerging Cross-Sectional Technologies | 12 | Expired |
| US4644265A | Noise reduction during testing of integrated circuit chips | Physics | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.